ACM Research Inc

ACM Research, Inc. engages in the development, manufacture, and sale of single-wafer wet cleaning equipment. The company is headquartered in Fremont, California and currently employs 2,023 full-time employees. The company went IPO on 2017-11-03. The firm offers two principal models of wet wafer cleaning equipment based on its Space Alternated Phase Shift (SAPS) technology, Ultra C SAPS II and Ultra C SAPS V. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional (3D) wafers with fine feature sizes. The company has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The firm also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers.

ACM Research, Inc. terlibat dalam pengembangan, pembuatan, dan penjualan peralatan pembersih wafer tunggal. Perusahaan ini berkantor pusat di Fremont, California dan saat ini memiliki 1.590 karyawan penuh waktu. Perusahaan ini mengalami Initial Public Offering pada tanggal 3 November 2017. Perusahaan menawarkan dua model utama peralatan pembersih wafer basah berdasarkan teknologi Space Alternated Phase Shift (SAPS) yaitu Ultra C SAPS II dan Ultra C SAPS V. Mereka juga mengembangkan teknologi Timely Energized Bubble Oscillation (TEBO) untuk aplikasi dalam pembersihan wafer basah selama pembuatan wafer 2D dan 3D dengan ukuran fitur yang halus. Perusahaan telah mendesain peralatan ini untuk digunakan dalam fabrikasi chip ditemui, logika, dan memori, termasuk dynamic random-access memory (DRAM), 3D NAND-flash memory chips, dan chip semikonduktor campuran. Perusahaan juga mengembangkan, memproduksi, dan menjual berbagai peralatan kemasan canggih untuk pelanggan montase wafer dan kemasan.

ACMR

ACM Research, Inc. engages in the development, manufacture, and sale of single-wafer wet cleaning equipment. The company is headquartered in Fremont, California and currently employs 2,513 full-time employees. The company went IPO on 2017-11-03. The company has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. The company has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The company also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.

ACM Research, Inc. terlibat dalam pengembangan, pembuatan, dan penjualan peralatan pembersihan basah wafer tunggal. Perusahaan berkantor pusat di Fremont, California dan saat ini mempekerjakan 2.513 karyawan penuh waktu. Perusahaan melakukan penawaran umum perdana (IPO) pada 3 November 2017. Perusahaan juga telah mengembangkan teknologi Timely Energized Bubble Oscillation (TEBO) untuk aplikasi dalam pembersihan wafer basah selama pembuatan wafer dua dimensi (2D) dan tiga dimensi (3D) dengan ukuran fitur halus. Perusahaan telah merancang alat-alat ini untuk digunakan dalam pembuatan chip foundry, logika, dan memori, termasuk memori akses acak dinamis (DRAM), chip memori NAND-flash 3D, dan chip semikonduktor senyawa. Perusahaan juga mengembangkan, memproduksi, dan menjual berbagai alat pengemasan lanjutan kepada pelanggan perakitan dan pengemasan wafer. Alat pengemasan lanjutan lainnya termasuk Ultra ECP ap, Ultra C Developer, dan Ultra C PR Megasonic-Assisted Stripper.

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